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High Precision Multi Head Chip Mounter Machine For Optical Modules Driver Modules

Brand Name:	UW
MOQ:	1set
Price:	Negotiation
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Certification:

CE ISO

Production Cycle:

3s-12s

Chip Size:

0.15×0.15mm-5×5mm (Lens To Be Replaced Per Product Requirements)

PR System:

256 Grayscale Levels / Edge Detection

Resolution:

1920pixel×2560pixel

Weight:

1200KG (Subject To Actual Product)

Standard Track Width:

40-90mm

Packaging Details:

carton box/wooden box

Highlight:

Multi Head Chip Mounter Machine

High Precision Chip Mounter Machine

Product Description

Equipment Applications

Optical modules, HDMI/USB connectors, sensors, optical devices, light source modules, driver modules, etc.

Highlights

High-Precision Assembly: Equipped with SP-grade silent linear guides with a straightness tolerance of within 2 μm (measured by dial indicator). Adopts system laser interferometer motion compensation technology, featuring a positioning accuracy of ±0.8 μm and a repeat positioning accuracy of ±0.4 μm. Capable of achieving fast and high-precision fixed-duration control of 6 pulses within 100 ms, ensuring consistent precision across batch-produced equipment and minimizing accuracy deviations caused by moving components.
Reduced Misjudgment: The nozzle is configured with an independent micro-flow air circuit, enabling separate detection of each nozzle loop to reduce system misjudgment.
Strong Compatibility: Compatible with both optical chip and electrical chip mounting processes.
Professional Services: Supported by a dedicated vision technology team, which can customize efficient and accurate positioning solutions for various product types.
Customization Services: A eutectic module can be added to upgrade the equipment into a eutectic die bonder.

Technical Parameters

Parameter Name	Parameter Value
Production Cycle	3s-12s
Mounting Accuracy	±3 ~ ±5μm@3σ
Angular Accuracy	±0.5° @3σ
Chip Size	0.15×0.15mm-5×5mm (Lens to be replaced per product requirements)
Chip Thickness	0.076-1mm(3-40mil, standard)minimum thickness down to 0.05mm(2mil,optional)
Substrate Size	L: 100-300mm；W: 40-90mm(Customization optional for widths below 40 mm) H: 0.1-0.8mm(standard)0.8-2.0mm(optional)
Magazine Size	(To be provided by the customer according to product specifications)
Wafer Size	Compatible with 6–8 inch wafers (2-inch & 4-inch waffle packs)
Automatic θ Calibration	Range of ±15°
Maximum Wafer Angle Correction	360°
Bonding Force	20-300g
Standard Track Width	40-90mm
PR System	256 grayscale levels / edge detection
Resolution	1920pixel×2560pixel
PR Accuracy	5M(1920×2560pixel) FOV(16mm；×1,×2,×4)
Angular Tolerance	±0.1°
Dimensions	W: 1630mm; H: 1160mm; D: 1500mm (Subject to actual product)
Weight	1200KG (Subject to actual product)

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