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| Brand Name: | UW |
| MOQ: | 1set |
| Price: | Negotiation |
| Payment Terms: | T/T |
Equipment Overview
The equipment irradiates the cell surface with high-energy laser to excite carriers and generate localized high-density current, which triggers interdiffusion between the metal grid lines and the silicon substrate, forming excellent ohmic contact and effectively reducing contact resistance. Meanwhile, it avoids large-area damage to the passivation layer, thereby improving open-circuit voltage and short-circuit current, and significantly enhancing the conversion efficiency of the solar cell.
Highlights
• Self-developed UW laser with specialized optics; adjustable spot size and energy distribution.
• High-speed galvo + high-speed DD motor; cycle time ≤ 0.75s, meeting screen-printing line speed requirements.
• Flexible linear loading/unloading module; fast and low breakage.
• Supports offline/online modes; offline loading and online emergency unloading run independently; large capacity and easy to use.
• Custom imported probe array and high-conductivity stage; long life, high performance, low breakage.
• 0BB compatible; optimized area-scan process improves efficiency by 0.05% vs. Line-scan.
Technical Parameters
| Equipment Performance | Specifications |
| Operating Mode | Supports both online and offline production modes |
| Applicable Cell Size | Compatible with cells ≤ 230×230 mm (half-cells customizable) |
| Applicable Cell Thickness | 150±50μm |
| Loading/Unloading Method |
Online: connects to screen-printing sintering furnace belt; Offline: cassette loading/unloading |
| Processing Accuracy | ±15μm |
| Pattern Repeatability | ≤ ±10μm |
| Process Efficiency Improvement | ＞ 0.3% (not lower than industry-leading level) |
| Equipment Capacity |
182×182 mm: ≥ 9,500 pcs/h (dual‑channel, fingers ≤ 220); 210×210 mm: ≥ 9,000 pcs/h (dual‑channel) |
| Breakage Rate | ≤ 0.015% @182*182mm,≤ 0.02% @210*210mm |
| Equipment Dimensions (L×W×H) | 3616*1190*2250mm |
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