Backside Poly Laser Thinning Machine For TOPCon Cells Ingenious Design

Equipment Introduction

The laser beam irradiates the PSG surface and penetrates into the Poly layer, where the surface of the Poly layer absorbs photon energy and converts it into heat, causing thermal expansion on the Poly layer surface; the force generated by the expansion destroys the PSG structure and significantly reduces its compactness, so the modified PSG can be removed by alkaline cleaning after laser treatment.

After the laser selectively acts on the PSG in non-metallic regions, the PSG, Poly and SiO₂in non-grid regions can be sequentially removed by controlling the alkaline cleaning time, etching down to 1-4 μm into the silicon substrate; the Poly in metallic regions is retained to form a Poly-Finger structure, achieving an efficiency gain of 0.15% at the cell level and mainly an improvement in bifaciality at the module level.

Highlights

» Multiple auxiliary functions to improve process performance

• Under-platform cooling system avoids high-temperature interference and delivers better process stability;

• Equipped with a dedicated dust removal hood with blowing-supping convection for higher cleanliness (patented);

• Supports various inspection functions including fragment detection, crack detection, and AOI inspection.

» Ingenious design to reduce transport defects

• Custom slotted belt and direct motor connection ensure higher stability and effectively prevent dust contamination;

• New flat belt effectively avoids defects such as scratches and indentations;

• Air knife on the jig removes fragments and prevents hidden cracks.

» Ingenious design to reduce transport defects

• Custom slotted belt and direct motor connection ensure higher stability and effectively prevent dust contamination;

• New flat belt effectively avoids defects such as scratches and indentations;

• Air knife on the jig removes fragments and prevents hidden cracks.

» Laser processing for various film structures

• Diverse technical routes and mask layer materials;

• Multiple customized laser sources to maximize matching with process requirements.

» Laser processing for various film structures

• Diverse technical routes and mask layer materials;

• Multiple customized laser sources to maximize matching with process requirements.

» Universal design with high compatibility

• Loading & unloading unit supports multiple feeding methods and various cassette sizes;

• Lifting-rotating structure with unique temporary storage position for empty cassettes;

• Supports various inspection functions including fragment detection, crack detection, and AOI inspection.

Technical Parameters