| Brand Name: | UW |
| MOQ: | 1set |
| Price: | Negotiation |
| Payment Terms: | T/T |
Equipment Introduction
This machine adopts a picosecond laser to process perovskite, light-absorbing layers or metal electrode layers. Driven by short-pulse high-peak laser, it ensures no craters at the edges while scribing on the material surface, delivering controllable and stable processing results. It can accurately position and remove the target film layers to a precise depth without damaging the TCO substrate, and the scribed grooves feature excellent flatness and consistency at the bottom.
Highlights
Technical Parameters
| Equipment Performance | Specifications |
| Laser | IR/Green/UV picosecond laser |
| Power | 5–60W, optional |
| Applicable Cell Size | 600×600mm (Customizable) |
| Straightness | <5μm/m |
| Positioning Accuracy | ±5μm |
| Repeat Positioning Accuracy | ±2μm |
| Dead Zone | <100μm |
| Spot Shape | Square or circular spot |
| Line Width | 20–100μm, adjustable |
| Equipment Dimension (L×W×H) | 2500*2000*2500mm |