|
| Brand Name: | UW |
| MOQ: | 1set |
| Price: | Negotiation |
| Payment Terms: | T/T |
Equipment Introduction
Adopting self-developed lasers and optical path structures, this equipment is designed for scribing perovskite and edge cleaning of the perovskite layer. It first uses ultrafast laser for cutting and modification, followed by CO₂ laser for wafer separation, achieving high-quality processing with no chipping and no cracks.
Highlights
・Adopts self-developed picosecond laser for cutting and self-developed semiconductor laser for splitting, equipped with an integrated UW cutting & splitting optical output head.
・The whole machine features a modular and flexible design with simple operation.
・Equipped with an auto-focusing and alignment vision module for accurate identification and positioning.
・Extremely minimal chipping after splitting, no micro-cracks, high cutting quality and high processing efficiency.
Technical Parameters
| Equipment Performance | Specifications |
| Operation Mode | Compatible with both manual and automatic production modes |
| Applicable Size | Customizable according to product size |
| Laser | Cutting: UW-Ps-100; Splitting: UW-915-200 |
| Optical System | Equipped with UW self-developed integrated cutting & splitting optical output head |
| Applicable Thickness | 1-8 mm (customizable) |
| Loading & Unloading Method | Manual loading & unloading, connectable with upper and lower production lines |
| Chipping Size | ＜5μm |
| Straightness | ±5μm |
| Machine Dimensions | 1800*1400*2300mm |
english
français
Deutsch
Italiano
Русский
Español
português
Nederlandse
ελληνικά
日本語
한국
العربية
हिन्दी
Türkçe
indonesia
tiếng Việt
ไทย
বাংলা
فارسی
polski
