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| Brand Name: | UW |
| MOQ: | 1set |
| Price: | Negotiation |
| Payment Terms: | T/T |
Equipment Overview
The equipment adopts a dual-drive gantry platform and a customized feeding system. It is compatible with Gel-Pak, Wafer Pak, blister trays, and special fixtures, making it suitable for micro-assembly applications in the pump source industry.
Highlights
Technical Specifications
| Parameter Name | Specification |
| Cycle Time | 1.5s (Depends on product) |
| XY Placement Accuracy | ±20μm @ 3σ (Standard die accuracy) |
| Die Rotation | ±0.5° @ 3σ (Depends on product) |
| Die Size | 0.15×0.15mm - 5×5mm (Lens change required based on product) |
| Die Thickness | 0.076 - 1mm (3 - 40mil, Standard) Min. 0.05mm (2mil, Optional) |
| Lead Frame Size | L: 100-300mm; W: 40-90mm (Customization required for <40mm); H: 0.1-0.8mm (Standard), 0.8 - 2.0mm (Optional) |
| Tray Size | (Provided by customer based on product) |
| Size Range | 200*250mm |
| Alignment Standard | Center clamping, Y-direction edge alignment |
| Bonding Force | 20-300g (Customizable) |
| Pick-up Method | Blister tray, Metal tray |
| PR System | 256 Grayscale |
| Resolution | 5472pixel × 3648pixel (Customizable) |
| PR Accuracy | FOV (16.4mmX10.9mm) |
| Angle Tolerance | ±0.1° |
| Dimensions | W: 1240mm; H: 1550mm; D: 1800mm (Subject to final product) |
| Weight | 1500KG (Subject to final product) |
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