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| Brand Name: | UW |
| MOQ: | 1set |
| Price: | Negotiation |
| Payment Terms: | T/T |
Equipment Overview
This equipment is configured with a dual-drive gantry platform and a customized feeding platform, compatible with expansion rings, feeders, Wafer PAK, and vibratory bowls. It can handle a variety of materials and processes, including silver paste and silver film, and is suitable for automotive-grade SiC chips, DTS, clips, NTCs, resistors, etc.
Highlights
Technical Parameters
| Parameter Name | Parameter Values |
| Cycle Time | 4000ms (Dependent on product) |
| XY Placement Accuracy | ±15μm @ 3σ (Standard die accuracy; actual product accuracy depends on incoming materials) |
| Theta Range | ±1° @3σ |
| Force Control | 20g-300g |
| Die Size | 0.15×0.15mm-15×15mm |
| Die Thickness | ≥ 70um |
| NTC | Tape & Reel, Electronic Feeder |
| Capacity | 1000 pcs/h (Depending on jig matrix density) |
| Magazine | 4inch Gel-PAK,Wafer-PAK (Customizable) |
| Conveyor Width | 200*350mm (Customizable) |
| PR System | 256 Grayscale |
| Resolution | 1920pixel×2560pixel (Customizable) |
| PR Accuracy | 5M(1920×2560pixel) FOV(16mm；×1,×2,×4) |
| Dimensions (L×W×H) | 1600×1250×2000mm (L×W×H) |
| Weight | 2000kg |
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