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Picosecond Laser Wafer Scribing Machine To 8 Inches Size High Precision

Picosecond Laser Wafer Scribing Machine To 8 Inches Size High Precision

Brand Name: UW
MOQ: 1set
Price: Negotiation
Payment Terms: T/T
Detail Information
Certification:
CE ISO
Marble Positioning Accuracy:
≤ 10μm (Factory Parallelism / Flatness / Perpendicularity / Squareness)
Resolution:
1920pixel×2560pixel
Laser Source:
Picosecond Laser
Wavelength (nm):
300nm - 600nm
Dimensions:
Up To 8 Inches
Laser Output Mode:
Galvo Scanner / Output Head
Packaging Details:
carton box/wooden box
Highlight:

Picosecond Laser Wafer Scribing Machine

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High Precision Wafer Scribing Machine

Product Description

Equipment Overview

The equipment is designed for marking wafers up to 8 inches in size, as well as for scribing MARK points and characters on ITO glass.

 

Highlights

• High-Precision Recognition: Equipped with one set of high-precision alignment cameras, two sets of global recognition cameras, and one set of self-inspection camera.

• High-Precision Assembly: Features a marble base and high-precision linear motors for the drive axes.

• Superior Accuracy: Delivers high marking precision and is equipped with a self-inspection function after marking.

 

Technical Specifications

Parameter Name Parameter Value
Marble Positioning Accuracy ≤ 10μm (Factory Parallelism / Flatness / Perpendicularity / Squareness)
XY Repeatability ±0.5μm
XY Straightness 3μm (Within every 300mm range)
Laser Z-axis Repeatability ±3μm
Resolution 1920pixel×2560pixel
Vision Accuracy 1pix = 1μm (FOV within 2mm)
Laser Source Picosecond Laser
Wavelength (nm) 300nm - 600nm
Temperature Parameters Temperature range 10 - 40℃, ±0.1℃
Dimensions W: 1650mm; H: 1070mm; D: 1900mm (Subject to final product)
Weight 1800KG (Subject to final product)
Dimensions Up to 8 inches
Wafer Line width ≤ 50μm, Positioning accuracy ±0.01mm
ITO Glass Line width ≤ 50μm, Positioning accuracy ±0.01mm
Laser Output Mode Galvo Scanner / Output Head