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| Brand Name: | UW |
| MOQ: | 1set |
| Price: | Negotiation |
| Payment Terms: | T/T |
Equipment Overview
This equipment is designed for the high-precision assembly of optical modules, HDMI/USB connectors, sensors, optical devices, light source modules, and driver modules
Highlights
Specifications
| Parameter Name | Parameter Value |
| Cycle Time | 3s-12s (Depending on product) |
| Placement Accuracy | ±3 @3σ (Depending on product) |
| Angular Accuracy | ±0.5° @3σ (Depending on product) |
| Die Size | 0.15×0.15mm - 5×5mm (Lens change required based on product) |
| Die Thickness | 0.076 - 1mm (3 - 40mil, Standard). Min. 0.05mm (2mil, Optional) |
| Lead Frame Size | L: 100 - 300mm; W: 40 - 90mm (Customization required for <40mm). H: 0.1-0.8mm (Standard), 0.8-2.0mm (Optional) |
| Tray Size | Customer Provided |
| Wafer Size | Compatible with 6-8 inch wafers (2-inch, 4-inch waffle packs) |
| Auto θ Calibration | ±15° Range |
| Max Wafer Angular Correction | 360° |
| Bonding Force | 20-300g (Customizable) |
| Standard Track Width | 40-90mm (Customizable) |
| PR System | 256 Grayscale / Edge Detection |
| Resolution | 1920pixel×2560pixel (Customizable) |
| PR Accuracy | 5M (1920×2560pixel) FOV (16mm;×1,×2,×4) |
| Angular Tolerance | ±0.1 |
| Dimensions | W: 1630mm; H: 1160mm; D: 1500mm (Subject to final product) |
| Weight | 1200KG (Subject to final product) |
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